Back to results
US 2003/0155352 A1Published application
High-frequency heating apparatus
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorKazuhiro Kawai
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorKazuhiro Kawai
Estimating the term…
A part of a body of a high-voltage condenser (28) is arranged between a lower plate (23) constituting a heating chamber (21), and a bottom plate (27) thereby to reduce attachment dimension of the high-voltage condenser (28), whereby size-reduction and space-reduction of the high-frequency heating apparatus becomes possible, and an insulation distance between the high-voltage condenser (28) and metal-made parts constituting the high-frequency heating apparatus can be secured easily, so that the number of the parts can be reduced. Therefore, it is possible to provide the high-frequency heating apparatus which is advantageous also in resources-reduction, assembly efficiency, and price.
A high-frequency heating apparatus comprising:
A high-frequency heating apparatus comprising:
A high-frequency heating apparatus comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
Heating using microwaves: aspects relating to the microwave cavity
Electric heating
Term end not estimated
1. Field of the Invention
The present invention relates to an attachment method of a high-voltage condenser used in a high-voltage circuit of a high-frequency heating apparatus and attachment fittings for the high-voltage condenser.
2. Description of the Related Art
FIG. 1 is a perspective view showing an attachment method of a high-voltage condenser in a first embodiment of the invention;
FIG. 2 is a sectional view showing an arranging state of the high-voltage condenser in the first embodiment of the invention;
FIG. 3 is a transverse sectional view showing an attachment state of the high-voltage condenser in the first embodiment of the invention;
Embodiments of the invention will be described below with reference to drawings.
(Embodiment 1)
FIG. 1 is a perspective view showing a high-voltage condenser attaching method in a first embodiment of the invention. FIG. 2 is a sectional view showing an arrangement state of the high-voltage condenser in the first embodiment. FIG. 3 is a transverse sectional view showing an attachment position in the first embodiment.