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US 2003/0155261 A1Published application
Packaging of low application hot melt adhesive formulations
OwnerCharles W. Paul, Anthony P. Rodgersinventors
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Abstract
Films having a melting point below about 100° C. are used to package low temperature hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. The packaged adhesive is easy to handle and units are non-blocking.
Claims20
A packaged low temperature hot melt adhesive comprising a low temperature hot melt adhesive encased in a thermoplastic film having a melting point below about 100° C.
A method of packaging a low temperature hot melt adhesive comprising wrapping a low temperature hot melt adhesive in a thermoplastic film having a melting point below about 100° C.
Dependencies are inferred from the claim text.