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AssigneeApplied Materials, Inc.
InventorsJoseph Yahalom, Deenesh Padhi, Srinivas Gandikota, Girish A. Dixit
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Embodiments of the present invention generally relate to a method and apparatus for planarizing a substrate by electropolishing techniques. Certain embodiments of an electropolishing apparatus include a contact ring adapted to support a substrate, a cell body adapted to hold an electropolishing solution, a fluid supply system adapted to provide the electropolishing solution to the cell body, a cathode disposed within the cell body, a power supply system in electrical communication with the contact ring and the cathode, and a controller coupled to at least the fluid supply system and the power supply system. The controller may be adapted to provide a first set of electropolishing conditions to form a boundary layer between the substrate and the electropolishing solution to an initial thickness and may be adapted to provide a second set of electropolishing conditions to control the boundary layer to a subsequent thickness less than or equal to the initial thickness.
An electropolishing apparatus, comprising:
A method of electropolishing a substrate structure, comprising:
A method of electropolishing a substrate structure, comprising:
An aqueous electropolishing solution, comprising:
Dependencies are inferred from the claim text.