Sputter device
AssigneeKobe Steel, Ltd.
InventorsToshimitsu Kohara, Koichiro Akari
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Abstract
An object of the present invention is to alter the shape of the magnetic field with ease in the state of auxiliary magnet poles being disposed in a sputtering apparatus. In a sputtering apparatus according to the present invention, one or more magnetron type sputtering evaporation sources 3 and one or more auxiliary magnet poles 9 are disposed in a chamber 1 so as to surround a solid substance 2 to be deposited, wherein an angle changing mechanism for changing the alignment angle of the auxiliary magnet poles 9 relative to the solid substance 2 to be deposited in order to alter the shape of the magnetic field formed by the magnetron type sputtering evaporation sources 3 and the auxiliary magnet poles 9.
Claims6
A sputtering apparatus wherein one or more magnetron type sputtering evaporation sources (3) and one or more auxiliary magnet poles (9) are disposed in a chamber (1) so as to surround a solid substance (2) to be deposited,
- wherein an angle changing mechanism for changing the alignment angle of said auxiliary magnet poles (9) relative to said solid substance (2) to be deposited in order to alter the shape of the magnetic field formed by said magnetron type sputtering evaporation sources (3) and said auxiliary magnet poles (9).
Dependencies are inferred from the claim text.