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US 2003/0155231 A1Published application
Field adjusting apparatus for an electroplating bath
OwnerChao-Fu Wenginventor
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OwnerChao-Fu Wenginventor
Estimating the term…
An electric field adjusting apparatus for adjusting electric field distribution inside an electroplating bath is provided. The electric field adjusting apparatus has a regulation plate with a plurality of evenly distributed through holes. A plurality of evenly distributed through holes with a smaller total through hole area is formed in the regulation plate that corresponds to an area of a plated film on a wafer that conducts a larger current during an electroplating process (close to the edge of the wafer). Meanwhile, a plurality of evenly distributed through holes with a larger total through hole area is formed in the regulation plate that corresponds to an area of the plated film on the wafer that conducts a smaller current during an electroplating process (close to the central region of the wafer). Furthermore, the total area of through holes around a particular location is inversely proportional to the current density in the plated film over the plating object.
An electric field adjusting apparatus inside an electroplating bath with an anode and a cathode therein, wherein the cathode is connected to a wafer, an source metallic rod is connected to the anode and the wafer has a circular plating surface, and the electroplating process includes forming a plated film on the plating surface, comprising:
An electric field adjusting apparatus inside an electroplating bath with an anode and a cathode therein, wherein the cathode is connected to a plating object, an source metallic rod is connected to the anode and the plating object has a circular plating surface, and the electroplating process includes forming a plated film on the surface of the plating object, comprising:
An electroplating apparatus, comprising:
Dependencies are inferred from the claim text.