Thermally enhanced semiconductor build-up package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsIn-De Ou, Yi-Chuan Ding, Kun-Ching Chen
Life of this patent
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Abstract
A semiconductor build-up package includes a die, a metal carrier, and a plurality of dielectric layers. The metal carrier has a surface with a cavity for supporting the die. The surface of metal carrier is coplanar to the active surface of die for building up a plurality of dielectric layers. Each dielectric layer has metal columns for inner electrical connection. The metal carrier covers passive surface and sides of the die with a larger area for heat dissipating, so the heat generated from the die is dissipated fast through the metal carrier.
Claims16
A semiconductor build-up package comprising:
- a die having an active surface , a passive surface, sides between the active surface and the passive surface, and a plurality of bonding pads on the active surface of the die;
- a metal carrier having a surface with a cavity for accommodating the die;
- and
- a plurality of dielectric layers formed on the active surface of the die and the surface of the metal carrier, wherein each dielectric layer has a plurality conductive columns for inner electrical connection of the boding pads of the die, at least a layer of conductive traces is formed between the dielectric layers.
A semiconductor build-up package comprising:
- a die having an active surface, a passive surface and a plurality of bonding pads on the active surface of the die;
- a metal carrier having a surface with a cavity for accommodating the die;
- and
- a first dielectric layer on the active surface of the die and the surface of the metal carrier, wherein the first dielectric layer has a plurality of conductive columns bonded on the bonding pads of the die.
Dependencies are inferred from the claim text.