Heat sink apparatus with air duct
AssigneeHewlett-Packard Development Company, L.P.
InventorsChristopher G. Malone, Ryan Abbott
Life of this patent
Estimating the term…
Abstract
A heat dissipating apparatus. In one embodiment, a heat dissipating apparatus is comprised of a heat sink device having a plurality of cooling fins coupled to the heat sink device. The heat sink device is adapted to be thermally coupled to a heat source. The plurality of cooling fins are adapted to dissipate heat generated by the heat source. An air duct is coupled with the heat sink device. The air duct is for directing an airflow to the cooling fins to increase dissipation of the heat.
Claims19
A heat dissipating apparatus comprising:
- a heat sink device having a plurality of cooling fins coupled thereto, said heat sink device adapted to be thermally coupled to a heat source, said plurality of cooling fins adapted to dissipate heat generated by said heat source;
- and
- an air duct coupled with said heat sink device, said air duct for directing an airflow to said cooling fins to increase dissipation of said heat.
A heat dissipating apparatus comprising:
- a heat sink device having a plurality of cooling fins, said plurality of cooling fins comprising a first region of cooling fins and a second region of cooling fins, said plurality of cooling fins coupled to said heat sink device, said heat sink device adapted to be thermally coupled to a heat source, said plurality of cooling fins adapted to dissipate heat generated by said heat source;
- and
- an air duct coupled with said heat sink device, said air duct for directing an airflow to said plurality of cooling fins, said airflow directed through said first region of cooling fins and subsequently through said second region of cooling fins, wherein said first region of cooling fins generate less resistance to said airflow than said second region of cooling fins and wherein said first region of cooling fins are disposed in an airflow resistance minimizing pattern.
A heat dissipating system comprising:
- means for absorbing and dissipating heat generated by a heat source, said heat absorbing and dissipating means adapted to be thermally coupled to said heat source;
- and
- means for directing an airflow through said means for absorbing and dissipating means, said airflow for increasing said heat dissipation.
15 A method of heat dissipation comprising:
- directing an airflow around a plurality of cooling fins, said plurality of cooling fins coupled to a heat sink device, said heat sink device adapted to thermally coupled to a heat source, said plurality of cooling fins adapted to dissipate heat generated by said heat source, said airflow directed around said plurality of cooling fins by an air duct coupled to said heat sink device.
The method as recited in claim 15 further comprising minimizing pressure drop of said airflow when said airflow contacts said plurality of cooling fins.
The method as recited in claim 15 wherein said plurality of cooling fins are disposed in a first region of cooling fins and a second region of cooling fins.
Dependencies are inferred from the claim text.