Method for manufacturing laminated ceramic electronic component

A method for manufacturing a laminated ceramic electronic component comprising steps of:

• pulling out a carrier film from a carrier film roll;
• coating a surface of said carrier film with a ceramic slurry at a coating rate of about 30 m/min or higher;
• forming a ceramic green sheet by drying said coated ceramic slurry;
• forming an internal electrode pattern on said ceramic green sheet;
• obtaining a laminated body by laminating a plurality of said ceramic green sheets on which said internal electrode patterns are formed;
• obtaining ceramic sintered bodies by cutting said laminated body into individual elements and firing the individual elements;
• and
• forming external electrodes on the outside surfaces of said ceramic sintered bodies;
• wherein said surface of said carrier film on which said ceramic slurry is coated has a surface in which a maximum height Rmax as defined in Japanese Industrial Standard B0601 is about 0.2 μm or less, a mold release layer is formed in said surface of said carrier film on which said ceramic slurry is coated, and the maximum height Rmax as defined in Japanese Industrial Standard B0601 of the surface of said carrier film that is opposite to said surface of said carrier film on which said ceramic slurry is coated is about 0.5 μm to about 1 μm.

A method for manufacturing a laminated ceramic electronic component comprising steps of:

• pulling out a carrier film from a carrier film roll;
• coating a surface of said carrier film with a ceramic slurry at a coating rate of about 30 m/min or higher;
• forming a ceramic green sheet by drying said coated ceramic slurry;
• forming an internal electrode pattern on said ceramic green sheet;
• obtaining a laminated body by laminating a plurality of said ceramic green sheets on which said internal electrode patterns are formed;
• obtaining ceramic sintered bodies by cutting said laminated body into individual elements and firing the individual elements;
• and
• forming external electrodes on the outside surfaces of said ceramic sintered bodies;
• wherein said surface of said carrier film on which said ceramic slurry is coated has a surface in which a maximum height Rmax as defined in Japanese Industrial Standard B0601 is about 0.2 μm or less, a mold release layer is formed in said surface of said carrier film on which said ceramic slurry is coated, and the maximum height Rmax as defined in Japanese Industrial Standard B0601 of the surface of said carrier film that is opposite to said surface of said carrier film on which said ceramic slurry is coated is about 0.2 μm to about 1 μm, and an anti-static layer is formed on at least one surface of said carrier film.