Pressure sensor
AssigneeDenso Corporation
InventorsSeiichiro Ishio, Yasutoshi Suzuki
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Abstract
A pressure sensor includes a sensor element, and a resin package member that holds the sensor element. The sensor element is constructed by a semiconductor, and is capable of externally outputting an electric signal in accordance with strain generated when force is applied thereto. The sensor element is directly adhered to the package member via an adhesive layer that has Young's modulus in a range between 2.45×103 Pa and 2.06×104 Pa. Further the adhesive layer has a thickness equal to or more than 110 μm. Accordingly, the pressure sensor effectively restricts a variation in a sensor characteristic due to a thermal change.
Claims5
A pressure sensor comprising:
- a sensor element constructed by a semiconductor, the sensor element being strained in accordance with an applied external force, and outputting an electric signal based on the strain;
- a package member made of resin, that is disposed to support the sensor element;
- and
- an adhesive layer through which the sensor element is directly adhered to the package member,
- wherein the adhesive layer has a Young's modulus in a range between 2.45×103 Pa and 2.06×104 Pa.
Dependencies are inferred from the claim text.