Method for reducing apparent height of a board system
OwnerPaul Aurelio Martinezinventor
Life of this patent
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Abstract
A method for reducing an apparent height of a board system is provided. The board system may include, for example, a carrier, a component, a printed circuit board and/or a solder material. The component is mounted on a first side of the carrier. The printed circuit board has a hole that is structured to accommodate the component. The solder material solders the carrier to the printed circuit board and provides a structural bond between the carrier and the printed circuit board. At least one portion of the solder material provides an electrical coupling between the carrier and the printed circuit board and at least one portion of the component is maintained in the hole after the carrier is soldered to the printed circuit board.
Claims7
A method for reducing apparent height of a component of a printed circuit board, comprising the steps of:
- (a) mounting the component on a carrier;
- (b) creating a hole in the printed circuit board, the hole being large enough to accommodate the component;
- (c) disposing at least a portion of component within the hole of the printed circuit board;
- and
- (d) soldering the carrier to the printed circuit board using a solder material.
Dependencies are inferred from the claim text.