Attaching device for mounting and fixing a device for generating heat and a heat sink provided on the device for generating heat on a board, amount board having the board, the device for generating heat, and the heat sink, and an attaching method of the device for generating heat and the heat sink provided on the device for generating heat on the board
AssigneeFujitsu Limited
InventorKouichi Shinotou
Life of this patent
Estimating the term…
Abstract
An attaching device is provided for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board, and a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.
Claims9
An attaching device for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board, comprising:
- a base part fixed to the board;
- a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board;
- and
- a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.
A mount board having a board, a semiconductor device fixed to the board, and a heat sink provided on the semiconductor device,
- wherein the semiconductor device and the heat sink are fixed to the board by an attaching device,
- the attaching device comprising:
- a base part fixed to the board;
- a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board;
- and
- a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.
An attaching method of a semiconductor device and a heat sink provided on the semiconductor device on a board by an attaching device, wherein
- a rotation device rotatably provided at a base part of the attaching device is rotated so as to be received at the base part, so that the semiconductor device is fixed and the heat sink is pressed to the semiconductor device.
Dependencies are inferred from the claim text.