Process and apparatus for disengaging semiconductor die from an adhesive film

A method for disengaging a semiconductor die from a film comprising:

• forming a plurality of dice on a semiconductor substrate;
• attaching a bottom surface of the semiconductor substrate to a film dicing the semiconductor substrate into a plurality of individual die, wherein a bottom surface of the plurality of individual die remains attached to the film;
• disengaging a semiconductor die from the film, wherein disengaging further comprises:
• placing the plurality of individual die on an anvil;
• aligning a semiconductor die over an opening in the anvil;
• projecting a blade through the opening in the anvil to facilitate separation of the semiconductor die from the film, wherein the blade has a surface for disengaging the semiconductor die from the film that is inclined relative to a bottom surface of the semiconductor die;
• and
• lifting an edge portion of the semiconductor die above a surface of the anvil with the blade to facilitate disengagement the semiconductor die from the film.