Method to embed thick film components
AssigneeE.I. du Pont de Nemours and Company
InventorJohn James Felten
Life of this patent
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Abstract
The invention is directed to a method to embed a thick film resistor composition into a printed wiring board comprising the steps of applying a reinforcing composition onto a resistor composition disposed on a metallic substrate forming an assembly wherein the resistor composition is at least partially coated with the reinforcing composition; processing the assembly; and applying the assembly onto at least one side of an organic substrate forming a component wherein the organic substrate is at least partially coated with an adhesive layer and wherein the reinforcing composition side of the assembly is embedded into the adhesive layer. The reinforcing composition allows laser trimming of the fired resistor and also eliminates cracking during lamination steps of the invention.
Claims14
A method to embed a thick film resistor composition into a printed wiring board comprising:
- (a) applying a reinforcing composition onto a resistor composition disposed on a metallic substrate forming an assembly wherein the resistor composition is at least partially coated with the reinforcing composition;
- (b) processing the assembly;
- and
- (c) applying the assembly onto at least one side of an organic substrate forming a component wherein the organic substrate is at least partially coated with an adhesive layer and wherein the reinforcing composition side of the assembly is embedded into the adhesive layer.
Dependencies are inferred from the claim text.