Ultrasound probe wiring method and apparatus
AssigneeKoninklijke Philips Electronics N.V.
InventorDavid G. Miller
Life of this patent
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Abstract
Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.
Claims16
A method of wiring an IC, the method comprising:
- electrically connecting first ends of traces on a circuit board to lands on the IC;
- connecting a first flex circuit to second ends of electrical traces on the circuit board;
- and
- connecting a second flex circuit to the IC.
A circuit comprising:
- an IC;
- a circuit board secured in a fixed relationship to the IC, the circuit board having electrical traces in communication with the IC;
- a first flex circuit connected to the circuit board so that leads on the flex circuit are in communication with the IC;
- and
- a second flex circuit connected to the IC, such that leads on the second flex circuit are in communication with the IC.
An ultrasound probe comprising:
- a plurality of transducer elements;
- an IC having a first and second set of lands on two different areas thereof, the IC being connected to the plurality of transducer elements via a communication channel there between;
- a circuit board bonded to the IC, the circuit board having a first and second set of lands on two different areas thereof, the first set of lands being electrically connected to the second set of lands, wherein the first set of lands is in close proximity to the first set of lands on the IC and the second set of lands being connected to the second set of lands on the IC;
- a first flex circuit connected to the first lands of the circuit board so that electrical leads on the flex circuit are in communication with the second set of lands on the IC;
- and
- a second flex circuit connected to the first set of lands on the IC.
The ultrasound probe, as set forth in claim I1, wherein the first flex circuit comprises:
- a first end, having leads with a first density, connected to the first lands of the circuit board;
- and
- a second end divided into branches, wherein in each of the branches has leads with a density less than the first density.
Dependencies are inferred from the claim text.