Novel polymer compound, precursor for the same and thin film-forming method using the same polymer precursor
AssigneeChisso Corporation
InventorTakashi Kato
Life of this patent
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Abstract
Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): 1 (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): 2 (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R1 and R2 each represent independently an alkyl group having 1 to 5 carbon atoms).
Claims41
A salt of a multifunctional amine represented by Formula (1):
- 17
- (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2):
- 18
- (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R1 and R2 each represent independently an alkyl group having 1 to 5 carbon atoms).
A polyimide represented by Formula (4):
- 20
- (wherein A represents a tetravalent organic group;
- B represents a tetravalent organic group having 1 to 20 carbon atoms;
- and n represents an integer of 0 to 3).
A polyimide represented by Formula (5):
- 21
Dependencies are inferred from the claim text.