Phase change material containing fusible particles as thermally conductive filler

A thermal interface material, comprising:

• a phase change polymer binder;
• a non-fusible particle filler;
• and
• a fusible filler.

An assembly, comprising:

• a heat sink;
• a first thermal interface material;
• and
• a die;
• wherein the first thermal interface material is a phase change polymer containing a fusible filler and a non-fusible particle filler.

A method for thermally connecting components, comprising:

• obtaining a die capable of generating heat;
• placing a thermal interface material onto a surface of the die where the thermal interface material is made of a phase change material, a fusible solder, and a non-fusible material;
• placing a heat sink on the opposite side of the thermal interface material;
• compressing the heat sink, the thermal interface material, and the die together;
• and
• running the die, the thermal interface material, and the heat sink through a reflow operation until the fusible solder becomes liquid.

A method of removing heat, comprising:

• obtaining a first thermal interface material made of a phase change material and a fusible solder;
• placing the thermal interface material against a surface of a die;
• positioning a heat sink against the opposite surface of the first thermal interface material;
• creating column structures of fusible solder by running the die, the first thermal interface material, and the heat sink through a reflow operation until the fusible solder becomes liquid;
• electrically connecting the die to a printed circuit board;
• generating heat by the operation of the die;
• and
• removing the heat by conduction from the die, though the first thermal interface material, to the heat sink.