IC socket module
AssigneeEspec Corp.
InventorsHirotaka Jiten, Michiya Kusaka
Life of this patent
Estimating the term…
Abstract
In order to carry out the electric property evaluation of internal wiring of an IC, the IC is attached to an IC socket, and terminals of the IC socket are connected with the external wiring via leads and coaxial connectors. The IC is directly in touch with a heating plate, for making the IC have a high temperature. The IC socket is provided with protrusions thereon, for forming a gap between the IC socket and the IC. On this account, it is possible to acquire an IC socket module in which the temperature of the IC is kept consistent when the evaluation of the internal wiring and wiring members of the IC is carried out at a high temperature.
Claims21
An IC socket module for carrying out electric property evaluation of internal wiring of an IC at a high temperature, comprising:
- an IC socket to which the IC is attached;
- protrusions, which are provided on the IC socket, for forming a gap between the IC socket and the IC;
- terminals which are attached to the IC socket;
- leads which are connected with the respective terminals;
- and
- coaxial connectors which are connected with (i) the respective leads and (ii) external wiring,
- the IC attached to the IC socket being directly in touch with a heating member so as to make the IC have a high temperature.
Dependencies are inferred from the claim text.