LSI device polishing composition and method for producing LSI device
AssigneeShowa Denko K.K.
InventorsYoshitomo Shimazu, Takanori Kido, Nobuo Uotani
Life of this patent
Estimating the term…
Abstract
The present invention provides an LSI device polishing composition containing water, abrasive grains, an organic acid, and an oxidizing agent, and having a pH of 5.5-10.0 adjusted by an alkaline substance, the LSI device polishing composition being used for polishing a copper-containing metal wiring layer in which copper is deposited on an insulating film via barrier metal formed of Ta or TaN; and a method for producing LSI devices by use of the polishing composition. During polishing of a barrier metal such as Ta or TaN and a copper wiring layer, the rate of polishing Ta or TaN can be enhanced, to thereby prevent dishing and erosion.
Claims17
An LSI device polishing composition for use in the preparation of a metal wiring layer, characterized by comprising water, abrasive grains, an organic acid, and an oxidizing agent, and having a pH of 5.5-10.0 adjusted by an alkaline substance.
An LSI device polishing composition for use in the preparation of a metal wiring layer, characterized by comprising water, abrasive grains, an organic acid, and an oxidizing agent, and having a pH of 5.5-9.0 adjusted by an alkaline substance.
A method for producing an LSI device comprising polishing, by use of a polishing composition, a copper-containing metal wiring layer in which copper is deposited on an insulating film via barrier metal formed of Ta or TaN, the composition comprising water, abrasive grains, an organic acid, and an oxidizing agent and having a pH of 5.5-10.0 adjusted by an alkaline substance.
A method for producing LSI devices comprising polishing, by use of a polishing composition, a copper-containing metal wiring layer in which copper is deposited on an insulating film via barrier metal formed of Ta or TaN, the composition comprising water, abrasive grains, an organic acid, and an oxidizing agent and having a pH of 5.5-9.0 adjusted by an alkaline substance.
Dependencies are inferred from the claim text.