Semiconductor device, and a method of producing semiconductor device

A method of manufacturing a semiconductor device comprising the steps of:

• providing first and second semiconductor chips each having a main surface comprising a semiconductor element and a plurality of external terminals, and a lower surface respectively opposing the main surface,
• providing a first lead frame comprising a frame body which supports outer portions and inner portions extending from the outer portions, and a second lead frame comprising a frame body which supports outer portions and inner portions extending from the outer portions,
• electrically connecting the plurality of external terminals of the first semiconductor chip to the inner portions of the first lead frame;
• electrically connecting the plurality of external terminals of the second semiconductor chip to the inner portions of the second lead frame,
• resin-sealing the first semiconductor chip and the second semiconductor chip so that the first lead frame and the second lead frame are superimposed,
• removing the frame body of the second lead frame,
• after the step of removing the frame body of the second lead frame, applying a first processing fluid to the outer portions of the first lead frame and the second lead frame, and
• after the step of the first applying processing fluid, removing the frame body of the first lead frame.