Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Jerrold L. King
Life of this patent
Estimating the term…
Abstract
A conductive plastic lead frame and method of manufacturing the same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.
Claims3
A manufacturing method for a plastic lead frame structure for use with at least one semiconductor device comprising injection molding one of a composite plastic material and an intermixed plastic and a conductive material, said conductive material including one of an intrinsic conductive polymer material or a polyaniline material.
A manufacturing method for a plastic lead frame structure for use with a semiconductor die comprising injection molding one of a composite plastic material and an intermixed plastic and a conductive material, said conductive material including one of an intrinsic conductive polymer material or a polyaniline material.
A manufacturing method for a plastic lead frame structure for use with a plurality of semiconductor dice comprising injection molding one of a composite plastic material and an intermixed plastic and a conductive material, said conductive material including one of an intrinsic conductive polymer material or a polyaniline material.
Dependencies are inferred from the claim text.