Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Jerrold L. King
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Abstract
A conductive plastic lead frame and method of manufacturing the same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.
Claims17
A manufacturing method for at least a portion of a semiconductor device package comprising:
- forming at least one conductive plastic lead frame having a plurality of lead fingers by one method of a method of stamping said at least one conductive plastic lead frame and a method of etching said at least one conductive plastic lead frame;
- attaching a semiconductor device having a plurality of bond pads to a portion of said at least one conductive plastic lead frame;
- connecting at least one bond pad of said plurality of bond pads of said semiconductor device to
- at least one lead finger of said plurality of lead fingers of said at least one conductive plastic lead frame;
- and
- encapsulating at least a portion of said semiconductor device and at least a portion of said at least one conductive plastic lead frame.
A method of manufacturing a circuit card comprising attaching one or more IC packages to said circuit card, at least one of said one or more IC packages containing at least one conductive plastic lead frame formed by one method of a method of stamping or a method of etching.
Dependencies are inferred from the claim text.