Fabrication method of semiconductor integrated circuit device
AssigneesRenesas Technology Corp., Eastern Japan Semiconductor Technologies, Inc.
InventorsBunshi Kuratomi, Fukumi Shimizu, Kenichi Imura, Katsushige Namiki, Fumio Murakami
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Abstract
At the time of performing a resin molding for a matrix frame in the fabrication of a semiconductor integrated circuit device, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of product obtained.
Claims17
A method of fabricating a semiconductor integrated circuit device, comprising the steps of:
- (a) providing a lead frame on which a plurality of device forming regions are arranged in a matrix form, the device forming regions each having a chip mounting portion and a plurality of leads;
- (b) mounting semiconductor chips respectively onto the chip mounting portions of the lead frame;
- (c) disposing the lead frame with the semiconductor chips mounted thereon onto a mold surface of a molding die which mold surface includes cavities, thereby closing the molding die;
- (d) pressurizing the interiors of the matrix cavities and charging a sealing resin into the thus-pressurized cavities;
- and
- (e) after the step (d), dividing the lead frame into the individual device forming regions.
A method of fabricating a semiconductor integrated circuit device, comprising the steps of:
- (a) providing a multi-chip substrate on which a plurality of device forming regions are arranged in a matrix form, the device forming regions each having a chip mounting region and a plurality of leads;
- (b) mounting semiconductor chips respectively onto the chip mounting regions of the multi-chip substrate;
- (c) disposing the multi-chip substrate with the semiconductor chips mounted thereon onto a mold surface of a molding die which mold surface includes a single cavity and thereafter closing the molding die while allowing the single cavity to cover all of the plural device forming regions;
- (d) pressurizing the interior of the cavity upon charging of a sealing resin into the thus-pressurized cavity;
- and
- (e) after the step (d), dividing the multi-chip substrate into the individual device forming regions.
Dependencies are inferred from the claim text.