Method of manufacturing a semiconductor device

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) separating a plurality of first semiconductor chips into pieces by dicing a first semiconductor wafer with the top surface thereof, partitioned into a plurality of first semiconductor chip-forming regions;
• (b) separating a plurality of second semiconductor chips into pieces by dicing a second semiconductor wafer with the top surface thereof, partitioned into a plurality of second semiconductor chip-forming regions;
• (c) preparing a first contact collet with a suction head coming in contact with the top surface of the respective first semiconductor chips, smaller in surface area than the respective first semiconductor chips, and sucking and securely holding the respective first semiconductor chips separated into pieces with the first contact collet by abutting the suction head of the first contact collet against the top surface of the respective first semiconductor chips separated into pieces;
• (d) executing die bonding of the respective first semiconductor chips over a top surface of a mounting base by pressing the back surface of the respective first semiconductor chips sucked and securely held by the first contact collet against the top surface of the mounting base;
• (e) preparing a second contact collet with a suction head coming in contact with the top surface of the respective second semiconductor chips, smaller in surface area than the respective second semiconductor chips, and sucking and securely holding the respective second semiconductor chips separated into pieces with the second contact collet by abutting the suction head of the second contact collet against the top surface of the respective second semiconductor chips separated into pieces;
• and
• (f) executing die bonding of the second semiconductor chip over the top surface of the respective first semiconductor chips by pressing the back surface of the second semiconductor chip sucked and securely held by the second contact collet against the top surface of the respective first semiconductor chips that are die-bonded on the top surface of the mounting base,
• wherein a first protection layer for preventing direct contact of the suction head of the first contact collet with the top surface of the respective first semiconductor chips is provided over the top surface of the respective first semiconductor chips prior to sucking and securely holding the respective first semiconductor chips with the first contact collet, and a second protection layer for preventing direct contact of the suction head of the second contact collet with the top surface of the respective second semiconductor chips is provided over the top surface of the respective second semiconductor chips prior to sucking and securely holding the respective second semiconductor chips with the second contact collet.

A method of manufacturing a semiconductor device, comprising preparing semiconductor chips and mounting the semiconductor chips over a mounting base after preparing the semiconductor chips, the step of preparing the semiconductor chips, comprising the steps of:

• (a) preparing a semiconductor wafer having a top surface with integrated circuits and a plurality of bonding pads, formed thereover, and a back surface opposite to the top surface, the top surface being partitioned into a plurality of semiconductor chip-forming regions by scribe lines;
• (b) forming a protection layer over the respective top surfaces of the plurality of the semiconductor chip-forming regions of the semiconductor wafer;
• (c) reducing the thickness of the semiconductor wafer by grinding the back surface thereof;
• and
• (d) forming a plurality of the semiconductor chips having the protection layer by cutting the semiconductor wafer along the scribe lines
• the step of mounting the semiconductor chips over the mounting base, comprising:
• (e) preparing a contact collet with a suction head smaller in surface area than the respective semiconductor chips, and securely holding the respective semiconductor chips with the contact collet by abutting the suction head of the contact collet against the protection layer formed over the top surface of the respective semiconductor chips;
• and
• (f) pressing the back surface of the respective semiconductor chips securely held by the contact collet against the top surface of the mounting base and bonding the respective semiconductor chips to the top surface of the mounting base.