Semiconductor device and method for manufacturing the same, circuit substrate and electronic apparatus
AssigneeSeiko Epson Corporation
InventorHiroyuki Tomimatsu
Life of this patent
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Abstract
The invention enhances reliability and achieves higher speeds for semiconductor devices with a stacked structure. A semiconductor device includes a die pad, a plurality of semiconductor chips stacked on one surface of the die pad, leads extending toward the die pad, first wires that are bonded to first pads of a first semiconductor chip among the plurality of semiconductor chips and to second pads of a second semiconductor chip among the plurality of semiconductor chips, second wires that are bonded to the leads and to the first pads or the second pads, and a sealing material that seals the plurality of semiconductor chips and exposes another surface of the die pad.
Claims23
A semiconductor device, comprising:
- a die pad;
- a plurality of semiconductor chips stacked on one surface of the die pad;
- a lead extending toward the die pad;
- a first wire that is bonded to a first pad of a first semiconductor chip among the plurality of semiconductor chips and to a second pad of a second semiconductor chip among the plurality of semiconductor chips;
- a second wire that is bonded to the lead and to one of the first pad and the second pad;
- and
- a sealing material that seals the plurality of semiconductor chips and exposes another surface of the die pad.
A method for manufacturing a semiconductor device, comprising:
- (a) stacking a plurality of semiconductor chips on one surface of a die pad;
- (b) bonding a first wire to a first pad of a first semiconductor chip among the plurality of semiconductor chips and to a second pad of a second semiconductor chip among the plurality of semiconductor chips;
- (c) bonding a second wire to a lead that extends toward the die pad and to one of the first pad and the second pad;
- and
- (d) sealing the plurality of semiconductor chips and exposing another surface of the die pad.
Dependencies are inferred from the claim text.