Method for manufacturing light-emitting device using a group lll nitride compound semiconductor
AssigneeToyoda Gosei Co., Ltd.
InventorsHiroshi Watanabe, Naoki Shibata
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AssigneeToyoda Gosei Co., Ltd.
InventorsHiroshi Watanabe, Naoki Shibata
Estimating the term…
A method for manufacturing a light-emitting device which using group III nitride group semiconductors and a quantum well structure, comprising forming a well layer (e.g. an InGaN layer), forming a cap layer on the well layer, the cap layer having almost the same compositions as the well layer at a temperature similar to that at which the well layer was formed. Further, and the cap layer is formed at a crystal growth rate which is faster than the crystal growth rate of the well layer and removing the cap layer using a thermal cracking (or decomposition) process during the temperature ramp up associated with the formation of the next group III nitride compound semiconductor layer. After the cap layer is removed, the group III nitride compound semiconductor layer is formed on the exposed well layer.
A method for manufacturing a light-emitting device using group III nitride group compound semiconductor having a quantum well structure, comprising steps of:
A method for manufacturing a light-emitting device using group III nitride compound semiconductors having a quantum well structure on a substrate, comprising steps of:
Dependencies are inferred from the claim text.