Photostructured paste
OwnerClaudio De La Prieta, Thomas Schulte +2inventors
InventorsClaudio De La Prieta, Thomas Schulte, Uwe Glanz, Petra Kuschel
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Abstract
A photostructurable paste is proposed which is particularly suitable for manufacturing structured resistor layers or printed circuit traces on ceramic blank substrates. In this context, the paste has a light-sensitive organic binder and a filler material, the binder including a polymer, a photoinitiator, an inhibitor for a thermal polymerization, an organic disulfide and an organic solvent. The filler material is a platinum powder, a platinum compound or a mixture of a platinum powder or a platinum compound with a ceramic powder or a ceramic precursor compound.
Claims13
A photostructurable paste, in particular for manufacturing structured resistor layers or pinted circuit traces on ceramic blank elements, having a filler material and a light-sensitive organic binder which includes a polymer, a photoinitiator, an inhibitor for a thermal polymerization, an organic disulfide and an organic solvent, the filler material being a platinum powder, a platinum compound or a mixture of a platinum powder or a platinum compound with a ceramic powder or with a ceramic precursor compound.
The photostructurable paste as recited in at least one of the preceding claims,
- wherein the filler material is added in a proportion of 30% through 90% based on the total weight of the paste.
The photostructurable paste as recited in at least one of the preceding claims,
- wherein the ceramic powder is an Al2O3 powder, an in particular yttrium-stabilized ZrO2 powder, a Y2O3 powder, a TiO2 powder, an SiO2 powder or a mixture of these powders.
The photostructurable paste as recited in at least one of the preceding claims,
- wherein the components of the paste are included in the following mass proportions based on the mass of the inorganic filler material:
- 2 filler material 100.00 polymer 9.00 to 36.00 photoinitiator 0.50 to 3.50 organic disulfide 0.20 to 2.00 inhibitor of thermal polymerization 0.01 to 0.35 organic solvent 5.50 to 21.50
The photostructurable paste as recited in at least one of the preceding claims,
- wherein after exposure, the paste may be developed using a water-soluble base solution.
The photostructurable paste as recited in at least one of the preceding claims,
- wherein the inorganic filler material and the organic binder are dispersed in the paste.
The photostructurable paste as recited in at least one of the preceding claims,
- wherein the polymer is a copolymer of alkylacrylates and alkylmethacrylates, whose alkyl groups have 1 through 12 carbon atoms;
- and/or the polymer is a copolymer of cycloalkyl(meth)acrylates, arylalkyl(meth)acrylates, styrol, acrylonitrile or their mixtures and unsaturated carboxylic acids, whose free carboxyl groups are verestert with 2,3-epoxypropyl(meth)acrylate and/or allylglycidylether.
The photostructurable paste as recited in at least one of the preceding claims,
- wherein the photoinitiator is 2,6-dimethoxybenzoyldiphenylphosphine, the organic solvent is benzyl alcohol, the organic disulfide is didodecyl disulfide, and the inhibitor of the thermal polymerization is 2,6-di-tert-butyl-1,4-cresol.
Dependencies are inferred from the claim text.