US 2003/0152691 A1 · In-line deposition processes for circuit fabrication

Abstract

In one embodiment, the invention is directed to aperture mask deposition techniques using aperture mask patterns formed in one or more elongated webs of flexible film. The techniques involve sequentially depositing material through mask patterns formed in the film to define layers, or portions of layers, of the circuit. A deposition substrate can also be formed from an elongated web, and the deposition substrate web can be fed through a series of deposition stations. Each deposition station may have an elongated web formed with aperture mask patterns. The elongated web of mask patterns feeds in a direction perpendicular to the deposition substrate web. In this manner, the circuit creation process can be performed in-line. Moreover, the process can be automated to reduce human error and increase throughput.

Claims60

Dependent claims

A repositionable aperture mask comprising:

an elongated web of flexible film;
and
a deposition mask pattern formed in the film, wherein the deposition mask pattern defines deposition apertures that extend through the film that define at least a portion of an integrated circuit.

Dependencies are inferred from the claim text.

In-line deposition processes for circuit fabrication

Life of this patent

In-line deposition processes for circuit fabrication

Life of this patent

Abstract

Claims60