Method for operating and controlling electroless plating
OwnerYuh Sung, Te-Hui Cheng +3inventors
InventorsYuh Sung, Te-Hui Cheng, Ming-Der Ger, Le-Min Weng, Bing-Joe Hwang
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Abstract
The present invention discloses a method for operating and controlling electroless plating, which comprises plating a substrate with a plating solution, the substrate is controlled at a constant temperature between 25° C. to 200° C., and the plating solution is kept at a lower temperature than that of the substrate. According to the method of the present invention, superior depositing rates can be achieved, undesired spontaneous decomposition of the plating solution at high temperature can be avoided and no stabilizers are necessary.
Claims4
A method for operating and controlling electroless plating, which comprises plating a substrate with a plating solution, said substrate is controlled at a constant temperature between 25° C. to 200° C., and said plating solution is kept at a lower temperature than that of said substrate.
Dependencies are inferred from the claim text.