Modular memory device
AssigneeMatrix Semiconductor, Inc.
InventorsJ. James Tringali, P. Michael Farmwald, Thomas H. Lee, Mark G. Johnson, Derek J. Bosch
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Abstract
In one embodiment, a modular memory device is presented comprising a substrate, a memory array fabricated above the substrate, and first and second circuitry fabricated on the substrate and under the memory array. The first and second circuitry allow the modular memory device to interface with first and second varieties of host devices, respectively. In another embodiment, a modular memory device is presented comprising a substrate, a memory array fabricated above the substrate, memory array support circuitry fabricated on the substrate, and logic circuitry fabricated on the substrate and under the memory array.
Claims20
A modular memory device comprising:
- a substrate;
- a memory array fabricated above the substrate;
- first circuitry fabricated on the substrate and under the memory array, the first circuitry allowing the modular memory device to interface with a first variety of host devices;
- and
- second circuitry fabricated on the substrate and under the memory array, the second circuitry allowing the modular memory device to interface with a second variety of host devices.
A modular memory device comprising:
- a substrate;
- a memory array fabricated above the substrate;
- memory array support circuitry fabricated on the substrate;
- and
- logic circuitry fabricated on the substrate and under the memory array.
Dependencies are inferred from the claim text.