Multi-opening heat-dissipation device for high-power electronic components
AssigneeVIA Technologies, Inc.
InventorShih-Chang Ku
Life of this patent
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Abstract
A multi-opening heat-dissipation device for high-power electronic components includes a body, an extension extended from the body, and a radial fan. The radial fan is mounted on a bottom aperture of the body. The body further comprises a primary opening on a first face and a cavity communicating between the bottom aperture and the primary opening as a wind path. The body further includes at least one additional opening on a second face of the body. The at least one additional comprises a second opening faces a circuit board on which a high-power electronic component is mounted. The cool air can flow to at least one of the topside and bottom side of the circuit board through the second opening and cool the high-power electronic components directly.
Claims15
A multi-opening heat-dissipation device for high-power electronic components, comprising
- a body;
- an extension extended from the body;
- a radial fan mounted on a bottom aperture of the body;
- a primary opening on a first lateral face of the body;
- a cavity provided in said body communicating between said bottom aperture and said primary opening and forming a main wind path through said body;
- wherein
- said body further comprising at least one additional opening on a second lateral face of the body communicating with said cavity.
Dependencies are inferred from the claim text.