Printed circuit board assembly for automatic test equipment
AssigneeTeradyne, Inc.
InventorSteven Hauptman
Life of this patent
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AssigneeTeradyne, Inc.
InventorSteven Hauptman
Estimating the term…
A printed circuit board assembly adapted for immersion cooling is disclosed. The assembly includes a first circuit board having a first device side with a first portion configured to mount a first plurality of semiconductor devices. A second circuit board having a second device side with a second portion configured to mount a second plurality of semiconductor devices is disposed in confronting parallel relationship to the first circuit board. The assembly further includes a border element interposed between the first and second boards and disposed around the respective first and second portions. The border element cooperates with the first and second boards to form a liquid-tight container. An inlet formed in the border receives an electrically nonconducting liquid that is subsequently discharged through an outlet.
A printed circuit board assembly including:
A printed circuit board assembly wherein the first and second circuit boards comprise channel cards for use in a semiconductor tester.
A printed circuit board assembly wherein the border comprises:
A printed circuit board assembly wherein the first and second printed circuit boards have devices mounted solely on the first and second device sides.
Automatic test equipment including:
A method of cooling a plurality of electronic devices, the method including the steps:
Dependencies are inferred from the claim text.