Power splitter having counter rotating circuit lines
AssigneeScientific Components Corporation
InventorLoren Ralph
Life of this patent
Estimating the term…
Abstract
A power splitter that has a small package size and low cross-talk noise. The power splitter includes a low temperature co-fired ceramic (LTTC) substrate with several layers. Electrical components such as transmission lines and resistors are integrated onto and within the LTCC substrate. The power splitter provides impedance matching and dividing functions. The LTCC substrate has counter rotating spiral shaped circuit lines and electrically conductive vias extending therethrough. The vias are used to connect the power splitter to an external printed circuit board. The vias are also used to make electrical connections between the layers of the LTCC substrate. The counter rotating circuit lines allow the power splitter to have a small package size and low cross-talk noise.
Claims24
A power splitter comprising:
- a) a substrate having a plurality of layers;
- b) a resistor formed on an outer layer;
- c) a first transmission line formed by a first spiral shaped circuit line formed on an inner layer;
- d) a second transmission line formed by a second spiral shaped circuit line formed on the inner layer;
- e) a ground plane formed on another inner layer;
- and
- f) a plurality of vias extending between the layers for providing electrical connections between the resistor, the ground plane and the circuit lines.
A power splitter having an input port and a first and second output port comprising:
- a) a multi-layered low temperature co-fired ceramic substrate, the substrate having a first and a second outer surface;
- b) at least one resistor located on the first surface, the output ports located on the first surface and the input port located on the second surface;
- c) a first spiral shaped circuit line formed on a first inner layer, the first spiral shaped circuit line having a first end and a second end, the first end connected to the input port and the second end connected to the first output port;
- d) a second spiral shaped circuit line located adjacent the first spiral shaped circuit line, the second spiral shaped circuit line having a first end and a second end, the first end connected to the input port and the second end connected to the second output port;
- e) a ground plane formed on a second inner layer;
- and
- f) a plurality of vias extending between the first surface, the second surface and the layers for providing electrical connections through the layers between the resistor, the ground plane and the circuit lines.
A method of manufacturing a power splitter comprising the steps of:
- a) providing a plurality of layers of low temperature co-fired ceramic;
- b) punching a plurality of holes in the low temperature co-fired ceramic layers;
- c) filling the holes with a conductive material to form a plurality of vias;
- d) screening at least one resistor on to a first layer;
- e) screening at least one spiral shaped circuit line onto a second layer;
- f) screening a ground plane onto a third layer;
- g) stacking the layers;
- h) firing the stacked layers in an oven to form a unitary substrate;
- and
- i) laser trimming the resistor.
A power splitter having an input port and a first and second output port comprising:
- a) a multi-layered low temperature co-fired ceramic substrate, the substrate having first, second, third, fourth, fifth, sixth and seventh layers, each layer having a top and bottom surface;
- b) at least one resistor located on the first layer;
- c) at least one circuit line formed on the second layer;
- d) a first spiral shaped circuit line formed on the fourth layer and having a first end and a second end, the first end connected to the input port and the second end connected to the first output port;
- e) a second spiral shaped circuit line located adjacent the first spiral shaped circuit line and having a first end and a second end, the first end connected to the input port and the second end connected to the second output port;
- f) a ground plane formed on the seventh layer;
- and
- g) a plurality of vias extending between the layers for providing electrical connections through the layers between the resistor, the ground plane and the circuit lines.
Dependencies are inferred from the claim text.