Wiring pattern and method of manufacturing the same and thin film magnetic head and method of manufacturing the same

A conductive pattern comprising:

• a substrate having an electrically insulating surface;
• a plurality of first conductive strip halves of a first conductive strip group, said first conductive strip halves having a second width and being arranged on the surface of the substrate such that the first conductive strip halves are separated from each other to form depressions having a first width;
• a plurality of first conductive strip halves of a second conductive strip group, said first conductive strip halves having a fourth width larger than the second width and being arranged on the surface of the substrate such that the first conductive strip halves are separated from each other to form depressions having a third width larger than the first width;
• a first insulating film formed on the surface of the substrate and surfaces of the depressions formed between successive first conductive strip halves of the first and second conductive strip groups;
• a second insulating film formed on a portion of the surface of the substrate at which said first conductive strip halves of the first and second conductive strip groups are not formed;
• a plurality of second conductive strip halves of the first conductive strip group formed on the first insulating layer such that said depressions formed between successive first conductive strip halves of the first conductive strip group are filled with the second conductive strip halves of the second conductive strip group;
• a plurality of second conductive strip halves of the second conductive strip group formed on the first insulating film such that said depressions formed between successive first conductive strip halves of the second conductive strip group are filled with the second conductive strip halves of the second conductive strip group, each of said second conductive strip halves of the second conductive strip group having a two-layer structure having a first conductive film formed by CVD and a second conductive film formed by electrolytic plating;
• and
• a third insulating film formed on a coplanar flat surface of the first and second conductive strip halves of the first conductive strip group, the first and second conductive strip halves of the second conductive strip group and the second insulting film.

A thin film magnetic head including a substrate and at least an inductive type thin film magnetic head element supported by the substrate;

• wherein said inductive type thin film magnetic head element comprises;
• a bottom pole made of a magnetic material which extends inwardly from an air bearing surface;
• a bottom track pole made of a magnetic material which extends inwardly from the air bearing surface over a distance corresponding to a track pole;
• a bridge portion made of a magnetic material and formed on one surface of the bottom pole such that a back gap is formed at a position remote from the air bearing surface;
• a thin film coil formed on the surface of the bottom pole such that a surface of the thin film coil opposite to the bottom pole forms a coplanar flat surface together with a surface of the bottom track pole;
• a write gap film made of a non-magnetic material and formed on said coplanar flat surface of said bottom track pole and thin film coil to have a flat surface;
• and
• a top pole formed on a surface of the write gap film opposite to the bottom track pole and including a top track pole aligned with the bottom track pole, said top pole being brought into contact with the bridge portion;
• wherein said thin film coil comprises:
• a first thin film coil half having coil windings mutually separated by a given distance;
• a second thin film coil half having coil windings which are formed between successive coil windings of the first thin film coil half in a self-aligned manner, at least a part of each of the coil windings of the second thin film coil half having a two-layer structure consisting of a first conductive film formed by CVD and a second conductive film formed by electrolytic plating;
• an insulating film formed to embed spaces between successive coil windings of the first and second thin film coil halves;
• a first jumper wiring connecting electrically an innermost coil winding of one of the first and second thin film coil halves to an outermost coil winding of the other of the first and second thin film coil halves;
• and
• a second jumper wiring having one end connected to an innermost coil winding of the other of the first and second thin film coil halves.

A method of manufacturing a thin film magnetic head including at least an inductive type thin film magnetic head element supported by a substrate;

• wherein a process of forming said inductive type thin film magnetic head element comprises the steps of:
• forming a first magnetic material film constituting a bottom pole such that the first magnetic material film is supported by the substrate;
• forming, on said first magnetic material film, a second magnetic material film constituting a bottom track pole and a bridge portion of back gap;
• forming, on said first magnetic material film, a thin film coil in an isolated manner;
• polishing surfaces of said second magnetic material film and thin film coil to form a coplanar flat surface;
• forming a write gap film made of a non-magnetic material on said coplanar flat surface such that the write gap film has a flat surface;
• forming, on the flat surface of said write gap film, a third magnetic material film constituting a top track pole and a top pole;
• forming a mask on a portion of the third magnetic material film at which a top track pole is to be formed;
• etching selectively said third magnetic material film such that a top track pole is formed and removing selectively a portion of the write gap film near the top track pole as well as the underlying second magnetic material film to form a bottom track pole;
• and
• forming an overcoat film made of an insulating material on a whole surface;
• wherein said step of forming the thin film coil comprises the steps of:
• forming, on said first magnetic material film, a plurality of coil windings of the first thin film coil half isolated from the first magnetic material film to form depressions such that portions of the depressions surrounded by said bottom pole, bottom track pole, top track pole, top pole and bridge portion have a narrower width than the remaining portions of the depressions;
• forming a first insulating film all over the first thin film coil half;
• forming, on said first insulating film, a first conductive film by CVD such that said portions of the depressions formed between successive coil windings of the first thin film coil half having a narrower width are completely filled with said first conductive film and said remaining portions of the depressions having a wider width are partially filled with said first conductive film;
• forming, on a portion of said first conductive film at which the thin film coil is to be formed, a second conductive film by electrolytic plating such that said remaining portion of the depressions having a wider width are completely filled with first and second conductive films;
• forming a second insulating film on a whole surface;
• and
• polishing said first and second conductive films, first insulating film covering surfaces of the coil windings of the first thin film coil half, and second insulating film to expose the surface of the coil windings of the first thin film coil half and form coil windings of a second thin film coil half arranged between successive coil windings of the first thin film coil half;
• wherein prior to forming said third magnetic material film, contact portions provided at ends of innermost and outermost coil windings of the first and second thin film coil halves are exposed, during the formation of the third magnetic material film, a first jumper wiring for electrically connecting a contact portion at an end of an innermost coil winding of one of the first and second thin film coil halves to an outermost coil winding of the other of the first and second thin film coil halves and a second jumper wiring connected to a contact portion at an end of an innermost coil winding of the other of the first and second thin film coil halves are formed with a same magnetic material as that of the third magnetic material film.