Substrate for electrooptic device and method of manufacturing the same, electrooptic device, and electronic equipment

A substrate for an electrooptic device, comprising:

• a light-transmissive base member;
• an underlayer formed on said base member, said underlayer including a hollow;
• a reflection layer formed over said base member so as to coincide with said underlayer, said reflection layer including a reflection portion and a transmission portion, said transmission portion having a transmission factor higher than a transmission factor of the reflection portion;
• and
• an orientation film formed over said base member so as to coincide with said reflection layer;
• wherein the transmission portion of said reflection layer and the hollow of said underlayer coincide with each other in plane;
• and
• wherein said orientation film defines a concavity where said orientation film enters said hollow of said underlayer.

A substrate for an electrooptic device, comprising:

• a light-transmissive base member;
• a reflection layer formed on said base member, said reflection layer including a reflection portion and a transmission portion, said transmission portion having a transmission factor higher than a transmission factor of the reflection portion;
• an insulating layer formed over said base member so as to coincide with said reflection layer, said insulating layer including a hollow at a position coinciding with the transmission portion in plane;
• and
• an orientation film formed over said base member so as to coincide with said insulating layer, said orientation film defining a concavity where said orientation film enters the hollow.

A method of manufacturing a substrate for an electrooptic device, comprising:

• the step of forming an insulating layer on a reflection layer;
• the step of patterning the insulating layer;
• the step of developing the reflection layer by employing the patterned insulating layer as a mask to thereby form an opening in the reflection layer;
• and
• the step of forming an electrode on the insulating layer and in the opening.