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US 2003/0151650 A1Published application
Droplet ejection apparatus, a pattern formation apparatus, a wiring formation apparatus, a pattern formation medium, a droplet ejection method, a patterning method and a wiring formation method
AssigneeSeiko Epson Corporation
InventorsTakashi Masuda, Katsuyuki Morii
Life of this patent
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Abstract
After a dispersion medium with a dispersed dispersoid or a solvent medium with a dissolved solute is ejected onto a substrate, the dispersoid or the solute is aggregated on both sides of the dispersion medium or the solvent medium by convecting the dispersoid or the solute within the dispersion medium or the solvent medium.
Claims25
An apparatus for ejecting a droplet, comprising:
- a droplet ejection means for ejecting the droplet formed by dispersing a dispersoid or the droplet formed by dissolving a solute;
- and
- a dispersion medium or solvent medium ejection means for ejecting a dispersion medium or a solvent medium in a location where the droplet is ejected.
A pattern formation apparatus, comprising:
- a dispersion or solution ejection means for ejecting the dispersion or the solution such that the interface of the dispersion formed by dispersing the dispersoid or the solution formed by dissolving the solute follows a prescribed pattern;
- and
- a dispersoid or solute aggregation means for aggregating the dispersoid or the solute at the interface of the dispersion or the solution.
A pattern formation apparatus, comprising:
- a dispersion or solution ejection means for ejecting a dispersion or a solution such that the interface of the dispersion formed by dispersing the dispersoid in a first dispersion medium or the solution formed by dissolving the solute in a first solvent medium follows a prescribed pattern;
- and
- a dispersion medium or solvent medium replenishment means for replenishing a second dispersion medium or a second solvent medium in the position where the dispersion or solution is ejected.
A wiring formation apparatus, comprising:
- a dispersion or solution ejection means for ejecting a dispersion or a solution such that the interface of the dispersion formed by dispersing conductive micro-particles or the solution formed by dissolving a conductive polymer follows a prescribed pattern;
- and
- a conductive micro-particle or conductive polymer aggregation means for aggregating the conductive micro-particles or the conductive polymer at the interface of the dispersion or the solution.
A pattern formation medium, comprising:
- a pattern for controlling the movement of a dispersion or a solution at the interface;
- and
- a dispersoid or a solute that is formed along the interface of the pattern by convecting within the dispersion or the solution.
A droplet ejection method, comprising:
- a process for ejecting a droplet formed by dispersing a dispersoid or a droplet formed by dissolving a solute;
- and
- a process for ejecting a dispersion medium or a solvent medium on top of the ejected droplet.
A patterning method forming a pattern of a dispersoid or a solute, wherein;
- a droplet, formed by dispersing the dispersoid in a convectable dispersion medium, or a droplet, formed by dissolving the solute in a convectable solvent medium, is ejected onto a prescribed location.
A patterning method, comprising:
- a step for ejecting a dispersion or solution containing a dispersoid or solute such that the interface of the dispersion medium with a dispersed dispersoid or the solvent medium with a dissolved solute follows a prescribed pattern;
- and
- a step for gathering the dispersoid or the solute at the interface of the dispersion medium or the solvent medium by vaporizing the dispersion medium or the solvent medium.
A patterning method, comprising:
- a step for forming a fluoroalkylsilane film on a substrate;
- a step for patterning the fluoroalkylsilane film by selectively irradiating ultraviolet light on the fluoroalkylsilane film;
- and
- a step for ejecting a dispersion formed by dispersing a dispersoid or a solution formed by dissolving a solute along the interface of the pattern of the fluoroalkylsilane film.
1 more element
A wiring formation method, comprising:
- a step for ejecting a dispersion or a solution such that the interface of the dispersion formed by dispersing micro-particles or the solution formed by dissolving the conductive polymer follows a prescribed pattern;
- and
- a step for aggregating the conductive micro-particles or the conductive polymer at the interface of the dispersion medium or the solvent medium by vaporizing the dispersion medium or the solvent medium contained in the dispersion or the solution.
Dependencies are inferred from the claim text.