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US 2003/0151486 A1Published application
Inductor and method for producing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsEiichi Uriu, Osamu Makino, Hironobu Chiba, Chisa Yokota
Life of this patent
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Abstract
A lamination ceramic chip inductor includes at least one pair of insulation layers; and at least one conductive pattern which is interposed between the at least one pair of insulation layers and forming a conductive coil. At least one conductive pattern includes a conductive pattern formed as a result of electroforming.
Claims12
A lamination ceramic chip inductor, formed by the process comprising the steps of:
- interposing at least one conductive pattern between at least one pair of insulation layers so as to be in contact with at least one of the pair of insulation layers;
- and
- forming a conductive coil,
- wherein the interposing step includes electroforming at least one conductive pattern, and no specific gap is formed between the conductive pattern and the pair of insulation layers.
1 more element
A lamination ceramic chip inductor, formed by the process comprising the steps of:
- forming a conductive coil by electroforming at least one conductive pattern;
- interposing said at least one conductive pattern between at least one pair of insulation layers so as to be in contact with at least one of the pair of insulation layers;
- laminating the conductive coil between said at least one pair of insulation layers to form an integral body;
- and
- sintering the integral body to form said lamination chip inductor;
- whereby in the lamination ceramic chip inductor no specific gap is formed at interfaces between the conductive pattern and said insulation layers when the integral body is sintered.
3 more elements
A lamination ceramic chip inductor, formed by the process comprising the steps of:
- interposing at least one conductive pattern between at least one pair of insulation layers so as to be in contact with at least one of the pair of insulation layers and so as to have no specific gap between the at least one conductive pattern and the at least one pair of insulation layers;
- and
- forming a conductive coil,
- wherein the interposing step includes electroforming the at least one conductive pattern, and the at least one conductive pattern has a thickness of 10 μm or more and a width to thickness ratio from 1 to less than 5.
1 more element
Dependencies are inferred from the claim text.