Process for fabricating an ADSL relay array
AssigneeAlcatel
InventorBruce Francis Orr
Life of this patent
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Abstract
A method of fabricating electro-magnetic relays and arrays of relays using existing and adapted PCB fabrication techniques, in which the activation coils are incorporated into the layers of a multi-layer PCB and the magnetic circuit of the relay is formed partly on the surface of the PCB using, eg, electroplating techniques, and partly in one or more through-holes using plated through holes, the plated through hole plating being extended to form a support for the movable relay contact which is formed on a removable release layer.
Claims19
A method for fabricating a relay integral with a substrate, the relay including a magnetic path, one or more activating current paths, and a switched path including the relay contacts, comprising the steps of:
- forming the activating current path or paths on or within the substrate,
- providing a first via or through-hole extending at least partly through the substrate,
- forming at least a first magnetic through link in the via or through hole in the substrate from a first surface thereof and proximate to the activating current path or paths so that the first magnetic link is within the influence of magnetic flux from the current paths,
- forming a first contact having both ferro-magnetic characteristics and electrical conductivity on or near a first surface of the substrate,
- providing a second contact having both ferro-magnetic characteristics and electrical conductivity on or near the surface of the substrate, at least one of the first or the second contacts being movable relative to the other contact to selectively make or break electrical contact,
- the first contact being in magnetic association with the first magnetic through link.
A method of forming a mechanical attachment to attach a relay element to a substrate, comprising the steps of:
- forming the element or applying the element in proximity to the substrate,
- forming an attachment hole through the element and the substrate,
- masking the element and substrate to leave the attachment hole exposed,
- seeding the attachment hole by deposition of a conductive layer therein and
- electroplating the attachment hole to build up an attachment element in intimate contact with the element and the substrate.
A method for forming a mechanical attachment to attach a relay element to a substrate, comprising the steps of:
- forming a plated-through hole in the substrate,
- applying a removable release layer over the substrate,
- forming an attachment hole in the release layer to expose the plated-through hole,
- filling the attachment hole with a support material in contact with, and attached to the plated-through hole and
- forming the relay element in contact with, and attached to the support material.
14 A method of forming a mechanical attachment between a relay element and a substrate, comprising the steps of:
- forming a plated-through hole in the substrate in the substrate;
- applying a removable release layer to a surface of the substrate;
- forming an attachment hole in the release layer;
- plating the element onto the release layer, the element being formed in contact with and attached to the plated-through hole through the attachment hole.
15 A method of forming a relay array, individual relays fabricated according to method of claim 1, wherein the individual relays are aligned in rows and columns, arranging the activating conductors of each row to pass through the magnetic loop of each relay in the row and arranging the activating conductors of each column to pass through the magnetic loop of each relay in the column.
16 A method of forming a relay array as claimed in claim 15, characteriszed by applying a magnetic sheet having alternate permanent magnetic strips of north and south poles aligned with the air-gaps of the rows or columns of relays.
17 A method of fabricating an array of miniature relays, comprising the steps of:
- forming a base PCB containing one of more layers of activating conductors, first contact parts, and contact connection conductors,
- forming or attaching a dissolvable layer on one side of the said base PCB,
- forming or placing preformed second contact parts on said dissolvable layer said second contact parts incorporating a flexible section with attachment means to said base PCB and
- removing said dissolvable layer.
18 A method as claimed in claim 17 wherein magnetic pathways are included the base PCB.
19 A method as claimed in claim 17 wherein a bias magnet means is placed on the opposite side of said base PCB to said contact parts.
Dependencies are inferred from the claim text.