Self-termination scheme in a double data rate synchronous dynamic random access memory device

Abstract

The present invention provides a memory device with a N-MOS self-termination scheme which enables or disables the device to eliminate ringing and line reflections in a memory device such as a DDR SDRAM. The self-termination is achieved by using a weak N-MOS transistor. The N-MOS transistors are within the device and has an impedance of two to eight times of the characteristic impedance of a communication path in a memory device such as DRAM or SRDAM. The communication path is generally a read/write or command/address bus. The self-termination scheme terminates line reflections occurring in a device receiving data during non productive time duration of system clock. The present invention provides a method by which random access memories perform with faster settling time for data inputs and a high system performance.

Dependencies are inferred from the claim text.