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US 2003/0151422 A1Published application
Method for burn-in testing
OwnerThomas S. Barnett, Matthew S. Grady +1inventors
InventorsThomas S. Barnett, Matthew S. Grady, Kathleen G. Purdy
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Abstract
Method for burn-in testing of a wafer having a plurality of dies where the reliability of the fail rate is matched to meet a predetermined criteria. This is accomplished by selecting a subset of dies to be tested and tests are used to weed out the highest number of failures.
Claims13
A method of burn-in testing semiconductor wafers with a plurality of dies wherein each die has a plurality of devices comprising:
- a) selecting a subset of die to be tested;
- b) conducting tests to weed out the highest number of failures;
- and
- c) determining a reliability fail rate to meet a predetermined criteria.
1 more element
A method for burn-in testing semiconductor wafers having a plurality of devices on a die comprising:
- a) determining an overall population reliability fail rate;
- b) separating die into groups of different reliability;
- c) selecting a group which meets a predetermined reliability criteria.
Dependencies are inferred from the claim text.