Test fixture for semiconductor package and test method of using the same

A test method of using a test fixture for semiconductor packages, allowing a plurality of semiconductor packages to be electrically connected to a test device by the test fixture, so as to perform tests for the semiconductor packages through the use of the test device;

• the test method comprising the steps of:
• preparing a circuit board;
• mounting an interposer on the circuit board, the interposer being formed with a plurality of through holes that penetrate through the interposer;
• disposing the plurality of semiconductor packages respectively in the through holes of the interposer, allowing the semiconductor packages to be accommodated on and electrically connected to the circuit board;
• attaching a covering member to the interposer, for covering the semiconductor packages received in the through holes of the interposer, wherein the covering member is formed on a surface thereof with a plurality of elastic mechanisms corresponding in position to the through holes in a manner that, the elastic mechanisms are adapted to abut against the semiconductor packages and provide a resilient force as to allow the semiconductor packages to be firmly in contact with the circuit board;
• and
• electrically connecting the circuit board to the test device, so as to allow the semiconductor packages to be electrically connected to the test device where tests are performed.