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US 2003/0151149 A1Published application
Semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorTakashi Ichikawa
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Abstract
A semiconductor device of the present invention is provided with a bonding pad for connecting a gold wire which serves as a bonding wire. Bonding pad is formed on a flat surface of an insulating layer, and has a plurality of recesses in a connection region of bonding pad to which a ball portion is connected. Thereby, it is possible to obtain a semiconductor device which has a bonding pad having excellent bonding characteristics with a simple manufacturing process.
Claims6
A semiconductor device comprising a bonding pad for connecting a bonding wire, wherein
- said bonding pad is formed on a flat surface, and a recess is created in a connection region of said bonding pad to which said bonding wire is connected.
Dependencies are inferred from the claim text.