Back to results
US 2003/0151148 A1Published application
Single unit automated assembly of flex enhanced ball grid array packages
AssigneeSt Assembly Test Services Pte Ltd
InventorsRaymundo M. Camenforte, John Briar
Life of this patent
Estimating the term…
Abstract
A new package is provided for the mounting of IC devices. The IC die is bonded to metal traces contained in a flexible tape, the IC die with the flexible tape is attached to a stiffener (heat spreader), the various heat conducting interfaces are cured and solder balls are attached to another surface of the flexible tape.
Claims26
A package for packaging an Integrated Circuit die, comprising:
- a TAB tape;
- a stiffener or heat spreader;
- a first adhesive layer for attaching said IC die to said stiffener;
- a second adhesive layer for attaching said IC die to said stiffener;
- and
- a plurality of solder balls.
3 more elements
A method for assembling of Tape Automated Bonding (TAB) or lead-frame packages said packages containing one Integrated Circuit die, comprising the steps of:
- providing an IC die;
- providing a flexible tape;
- attaching said die to the back wall of said cavity in said stiffener using a thermally conductive adhesive;
- attaching said flexible tape to a stiffener using tape adhesive;
- curing said thermally conductive material;
- bonding the copper traces on said TAB tape to the corresponding bond pads of the die using wire bond techniques;
- encapsulating said IC die inside said cavity thereby enclosing said die and said TAB wire bond connections;
- curing said encapsulating material;
- applying solder flux to one or more solder balls;
- applying solder balls to conductive pads on said TAB tape;
- re-flow said solder balls by applying heat;
- cleaning excess solder flux from conductive pads using an appropriate cleaning agent;
- and
- dry baking the IC package.
11 more elements
A method for assembling a multiplicity of Tape Automated Bonding (TAB) or lead-frame packages said packages containing an Integrated Circuit die, comprising the steps of:
- providing a multiplicity of IC dies;
- providing a flexible tape containing a multiplicity of flex tapes;
- providing a carrier strip;
- providing a multiplicity of stiffeners;
- attaching said multiplicity of stiffeners to said carrier strip;
- separating said multiplicity of flex tapes into individual sections of flex tapes whereby each section of flex tape accommodates one stiffener;
- transporting said stiffeners to successive work stations using said carrier strip as the means of transportation whereby each work station is dedicated to and equipped for performing one or more steps of assembly dedicated to the sequence of assembling said multiplicity of Tape Automated Bonding (TAB) or lead-frame packages;
- providing each stiffener with one matching section of flex tape;
- attaching an IC die that is part of said multiplicity of IC dies to the back wall of said cavity in a stiffener that forms part of said multiplicity of stiffeners using a thermally conductive adhesive;
- attaching a section of flexible tape to its matching stiffener using tape adhesive;
- curing said thermally conductive adhesive;
- bonding the copper traces on said flex tape to the corresponding bond pads of the IC die using inner bond leads;
- encapsulating said IC die inside said cavity thereby enclosing said die and said TAB inner lead bond connections;
- curing said encapsulating material;
- applying solder flux to one or more solder balls;
- applying solder balls to conductive pads on said flex tape;
- re-flow said solder balls by applying heat;
- cleaning excess solder flux from conductive pads using an appropriate cleaning agent;
- dry baking the IC package;
- and
- separating said multiplicity of stiffeners into individual stiffeners.
18 more elements
A method for assembling a multiplicity of Tape Automated Bonding (TAB) or lead-frame packages said packages containing an Integrated Circuit die, comprising the steps of:
- providing a multiplicity of IC dies;
- providing a flexible tape containing a multiplicity of flex tapes;
- providing a carrier strip;
- providing a multiplicity of stiffeners;
- attaching said multiplicity of stiffeners to said carrier strip;
- separating said multiplicity of flex tapes into individual sections of flex tapes whereby each section of flex tape accommodates one stiffener;
- transporting said stiffeners to successive work stations using said carrier strip as the means of transportation whereby each work station is dedicated to and equipped for performing one or more steps of assembly dedicated to the sequence of assembling said multiplicity of Tape Automated Bonding (TAB) or lead-frame packages;
- providing each stiffener with one matching section of flex tape;
- attaching an IC die that is part of said multiplicity of IC dies to the back wall of said cavity in a stiffener that forms part of said multiplicity of stiffeners using a thermally conductive adhesive;
- attaching a section of flexible tape to its matching stiffener using tape adhesive;
- curing said thermally conductive adhesive;
- bonding the copper traces on said flex tape to the corresponding bond pads of the IC die using wire bonding techniques;
- encapsulating said IC die inside said cavity thereby enclosing said die and said TAB inner lead bond connections;
- curing said encapsulating material;
- applying solder flux to one or more solder balls;
- applying solder balls to conductive pads on said flex tape;
- re-flow said solder balls by applying heat;
- cleaning excess solder flux from conductive pads using an appropriate cleaning agent;
- dry baking the IC package;
- and
- separating said multiplicity of stiffeners into individual stiffeners.
18 more elements
Dependencies are inferred from the claim text.