Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

A method of producing a semiconductor element, comprising the steps of:

• forming a metal film serving as a plating electrode on the whole part of a semiconductor substrate having an electrode formed thereon;
• forming a resist film having an opening in the position of said electrode on said metal film;
• depositing a high conductivity metal in columnar form to form a columnar projection by electrolytic plating;
• removing said resist film;
• etching to remove said metal film by using said columnar projection as a mask;
• and
• forming a wet prevention film on the surface of said columnar projection.

A method of producing a semiconductor element, comprising the steps of:

• forming a resist film having an opening in the position of said electrode on a semiconductor substrate having an electrode thereon;
• forming an activation processing layer by activation processing to electroless plating;
• removing said activation layer on the said resist film;
• depositing highly conductive metal in said opening by electroless plating to form a columnar projection;
• removing said resist film;
• and
• forming a wet prevention film on the surface of said columnar projection.

A semiconductor device, comprising;

• a conductive columnar projection formed on an electrode on a semiconductor element;
• a pad of a wiring substrate soldered to said conductive columnar projection;
• and
• a wet prevention film coated on at least of a part of side surface of said columnar projection which is close to said electrode.

A semiconductor device, comprising:

• a conductive columnar projection formed on an electrode on a semiconductor element;
• and
• a pad on a wiring substrate, which is soldered to said conductive columnar projection,
• wherein a soldered part of said columnar projection is only the upper surface of said columnar projection.

A semiconductor device, comprising:

• a conductive columnar projection formed on an electrode on a semiconductor element;
• and
• a pad on a wiring substrate, where said conductive columnar projection is soldered,
• wherein, said columnar projection is soldered to said pad through a metal film which is hard to be oxidize than said columnar projection and formed on said upper surface of said columnar projection or on the upper portion of side surface and upper surface of said columnar projection.

A semiconductor device, comprising:

• a conductive columnar projection formed on an electrode on a semiconductor element;
• and
• a pad on a wiring substrate, where said conductive columnar projection is soldered,
• wherein upper surface of said columnar projection and a pad surface of said wiring substrate is adhered through a metal film which is hard to be oxidized compared with said columnar projection.

A method of producing a semiconductor device, comprising the steps of:

• supplying the thermosetting resin having the flux activity effect to either on the tip part of a columnar projection formed on an electrode of a semiconductor element, or a pad of a wiring substrate soldered thereto;
• aligning said columnar projection and a pad of the wiring substrate supplied with predetermined quantity of solder;
• and
• heating and soldering only the tip part of said columnar projection to the pad of said wiring substrate.

A method of producing a semiconductor device, comprising the steps of:

• supplying flux to either of a tip part of a columnar projection formed on an electrode on a semiconductor element or on a pad of a wiring substrate which should be soldered thereto;
• aligning said columnar projection and a pad of a wiring substrate supplied with a pre-determined quantity of solder;
• heating and soldering only a tip part of said columnar projection to a pad on said wiring substrate;
• and
• cleaning and removing said flux.

A method of producing a semiconductor device, comprising the steps of:

• supplying a thermosetting resin having a flux activity effect to either of a tip part of a columnar projection or on a pad of a wiring substrate soldered thereto;
• aligning said columnar projection formed on an electrode on a semiconductor element and having a solder film on tip end thereof, and a pad on said wiring substrate;
• and
• heating and soldering only a tip part of said columnar projection to a pad on said wiring substrate.

A method of producing a semiconductor device, comprising the steps of:

• supplying flux to either of a tip part of a columnar projection or on a pad of a wiring substrate soldered thereto;
• aligning said columnar projection formed on an electrode on a semiconductor element and having a solder film on tip end thereof, and a pad on said wiring substrate;
• heating and soldering only a tip part of said columnar projection to a pad on said wiring substrate;
• and
• removing and cleaning said flux.

A method of producing a semiconductor device, comprising the steps of:

• aligning a columnar projection formed on an electrode on a semiconductor element and a pad of a wiring substrate supplied with a pre-determined quantity of solder;
• and
• heating and soldering only tip part of said columnar projection to a pad of said wiring substrate;
• wherein at least one of soldering part of said columnar projection or soldering part on the solder on said pad, thin gold film is formed.

A method of producing a semiconductor device, comprising the steps of:

• aligning a columnar projection formed on an electrode on a semiconductor element and having a solder film on tip end thereof, and a pad on a wiring substrate which should be soldered thereto;
• and
• heating and soldering only a tip part of said columnar projection to a pad of said wiring substrate;
• wherein thin metal film is formed on at least one of the solder film on said columnar projection and said pad.

A method of producing a semiconductor device, comprising the steps of:

• cleaning the tip surface of a columnar projection formed on an electrode on a semiconductor element and the pad surface on a wiring substrate by a physical shock of an inactive gas excited by plasma;
• aligning said columnar projection and a pad of said wiring substrate;
• and
• adhering said columnar projection and said pad said while pressurizing said semiconductor element and said wiring substrate.