Semiconductor device
AssigneeNEC Electronics Corporation
InventorNaoto Kimura
Life of this patent
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Abstract
In a semiconductor device including a metal substrate having one surface on which a semiconductor chip is mounted and the other surface on which solder balls are mounted, the semiconductor chip is electrically connected to the solder balls through through-holes formed in the substrate and bonding wires. An insulating film is formed on a whole surface of the substrate including inner surface of the through-holes and the solder balls are supported by the through-holes, so that a wiring connected to the electrically conductive through-holes and the semiconductor chip are electrically connected by the bonding wires. Diameter of the through-hole in the other surface of the substrate on which the solder ball is supported is larger than diameter of the through-hole in the one surface of the substrate.
Claims8
A semiconductor device comprising:
- a heat radiative substrate having one surface on which a semiconductor chip is mounted and a plurality of through-holes formed therein, said through-holes extending from said one surface to the other surface;
- a plurality of solder balls electrically connected to a wiring provided on said substrate, said solder balls being arranged on said the other surface of said substrate;
- bonding wires having one ends connected to bonding pads of said semiconductor chip and the other ends electrically connected to the plurality of said solder balls through said through-holes;
- and
- resin for sealing said semiconductor chip and said bonding wires on said one surface of said substrate.
Dependencies are inferred from the claim text.