US 2003/0151134 A1 · Semiconductor device

Abstract

A chip mounting method is proposed which considers facilitating the testing of semiconductor chips when a plurality of semiconductor chips are sealed in a single resin sealing body. This method also considers its application to a variety of MCPs and system LSIs. In a single package, one signal output terminal of the first semiconductor chip and a first external terminal of the semiconductor device are internally connected independently. One signal input terminal of the second semiconductor chip and a second external terminal of the semiconductor device are internally connected independently. The first and second external terminals of the semiconductor device are connected outside the semiconductor device to complete the connection between the signal output terminal and the signal input terminal.

Claims13

Dependent claims

A semiconductor device comprising:

a memory chip;
a first interface having a plurality of input/output external terminals for connection with a host unit;
and
a controller chip having a function to respond to a memory access request received from the host unit through the first interface and a function to convert the memory access request into an access unique to the memory chip and access-control the memory chip;
wherein the memory chip, the first interface and the controller chip are contained in a single package;
wherein a signal interface for the controller chip to access the memory chip is provided to a plurality of first external terminals of the package and a signal interface for the memory chip to be accessed is provided to a plurality of second external terminals of the package.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor device

Life of this patent

Semiconductor device

Life of this patent

Abstract

Claims13