RF transition for an area array package
AssigneeMIA-Com, Inc.
InventorsNoyan Kinayman, Bernard A. Ziegner, Richard Anderson, Jean-Pierre Lanteri, M. Tekamul Buber
Life of this patent
Estimating the term…
Abstract
A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.
Claims31
A substrate for an area array package,
- said substrate having a plurality of signal wirings, each having a first contact adapted to be connected to a respective terminal of an integrated circuit, and a second contact on a periphery of the substrate,
- said substrate having a ground structure including, for each signal wiring, a pair of rectangular ground plane portions located on opposite sides of the second contact of that signal wiring, and
- said substrate having a plurality of ground via holes through the substrate, including at least one respective ground via hole through each rectangular ground plane portion.
An area array package comprising:
- a substrate having:
- a plurality of signal wirings, each having a first contact adapted to be connected to a respective terminal of an integrated circuit, and a second contact on a periphery of the substrate,
- a ground structure including, for each signal wiring, a pair of rectangular ground plane portions located on opposite sides of the second contact of that signal wiring, and
- a plurality of ground vias through the substrate, including at least one respective ground via hole through each rectangular ground plane portion;
- a cover above the substrate, and
- a bottom layer of the package formed of a dielectric material.
A printed circuit board assembly, comprising:
- a printed circuit board having a circuit board substrate with circuit traces and a plurality of devices thereon, said plurality of devices including at least one integrated circuit package assembly that includes:
- a package substrate having:
- a plurality of signal wirings, each having a first contact adapted to be connected to a respective terminal of an integrated circuit, and a second contact on a periphery of the package substrate,
- a ground structure including, for each signal wiring, a pair of rectangular ground plane portions located on opposite sides of the second contact of that signal wiring, and
- a plurality of ground vias through the package substrate, including at least one respective ground via hole through each rectangular ground plane portion;
- a lid above the package substrate, and
- a bottom layer of the package formed of a dielectric material, the bottom layer having a plurality of solder attach pads, electrically connected to contacts of the circuit board substrate.
An area array package comprising:
- a substrate having a plurality of signal wirings, each having a first contact adapted to be connected to a respective terminal of an integrated circuit, and a second contact on a periphery of the substrate, the substrate having a signal via penetrating each second contact;
- a superstrate formed of a dielectric material above the substrate, the superstrate having a respective opening therethrough above each second contact;
- a lid above the superstrate;
- and
- a bottom layer of the package formed of a dielectric material.
A method for forming an area array package comprising the steps of:
- forming a plurality of signal wirings on a substrate, each signal wiring having a first contact adapted to be connected to a respective terminal of an integrated circuit, and a second contact on a periphery of the substrate, the substrate being formed of a type of material suitable for use in a printed circuit board;
- forming on a bottom layer of the area array package a plurality of solder attach pads aligned with the plurality of second contacts;
- forming a plurality of signal via holes penetrating the second contacts and solder attach pads and penetrating through the substrate and the bottom layer;
- filling the signal via holes with a conductive liquid capable of solidifying;
- and
- solidifying the conductive liquid to form conductive signal vias.
Dependencies are inferred from the claim text.