Semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorMuneyoshi Kawaguchi
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Abstract
The present invention has an object to provide a more compact semiconductor device that can be assembled with reduced parts and tasks. The semiconductor device includes a housing having a top and bottom surfaces. Surrounded within the housing is an insulating substrate with metal layers formed on both sides thereof. Also a semiconductor chip is mounted on one of the metal layer of the insulating substrate. A terminal connector extends along the top surface of the housing and is bent towards the bottom surface thereof for supplying power to the semiconductor chip. The housing has a housing through-hole extending from the top surface to the bottom surface through the housing, and the terminal connector has a terminal through-hole which are aligned with and formed coaxially with the housing through-hole.
Claims6
A semiconductor device, comprising:
- a housing having a top and bottom surfaces;
- an insulating substrate with metal layers formed on both sides thereof, said insulating substrate surrounded within said housing;
- a semiconductor chip mounted on one of the metal layer of said insulating substrate;
- and
- a terminal connector extending along the top surface of the housing and being bent towards the bottom surface thereof for supplying said semiconductor chip with power;
- wherein said housing has a housing through-hole extending from the top surface to the bottom surface through the housing, and wherein said terminal connector has a terminal through-hole which are aligned with and formed coaxially with the housing through-hole.
Dependencies are inferred from the claim text.