Semiconductor device

Abstract

To realize a semiconductor device with a highly reliable three-dimensional mounting module using a flexible circuit substrate which is easy to assemble a high density three-dimensional mounting module and is excellent in the workability in repair work (or re-work), a flexible circuit substrate 11 has mounting regions 111, 112 and 113 on which electronic components 121, 122 and 123 are mainly mounted, respectively, and other electronic components 124 and 125 are also mounted. The flexible circuit substrate 11 is structured in such a manner that the mounting regions 111˜113 are folded on top of the other over the base region 110 in a predetermined order (f1˜f3). An integrated spacer 13 is superposed and affixed to the flexible circuit substrate as indicated by arrows with broken lines, and supports the electronic components 121˜125 when the mounting regions 111˜113 are folded on top of the other. The integrated spacer 13 has thick regions 131 and thin regions 132.

Dependencies are inferred from the claim text.