Integrated circuit device
AssigneeShellcase Ltd.
InventorAvner Badehi
Life of this patent
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Abstract
An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces (317) being transparent to radiation, and electrically insulative edge surfaces (314) having pads.
Claims22
An integrally packaged optronic integrated circuit device including:
- an integrated circuit die containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces being transparent to radiation, and electrically insulative edge surfaces having pads.
An integrally packaged optronic integrated circuit device according to any of the preceding claims and also including color array filters.
An integrally packaged optronic integrated circuit device according to any of the preceding claims and also having lenses integrally formed on a transparent protective surface thereof.
An integrally packaged optronic integrated circuit device according to any of the preceding claims and also including light coupling bumps formed on a transparent protective surface thereof.
An integrally packaged optronic integrated circuit device according to any of the preceding claims and also including a waveguide and other optical components integrally formed on a transparent protective surface thereof.
An integrally packaged optronic integrated circuit device according to any of the preceding claims and also including an optical grating formed onto a transparent protective surface thereof.
An integrally packaged optronic integrated circuit device according to-any of the preceding claims and also including a polarizer integrated therewith.
An integrally packaged optronic integrated circuit device including:
- an integrated circuit die containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces being transparent to radiation, said integrally packaged optronic integrated circuit device being characterized in that its longest dimension does not exceed the longest dimension of the die by more than 20%.
An integrally packaged optronic integrated circuit device according to any of the preceding claims and wherein said circuit device is formed with an octagonal shape.
A method for producing an integrally packaged optronic integrated circuit device comprising the steps of:
- forming electrical circuits onto a semiconductor wafer;
- forming at least one transparent mechanical protective layer onto said semiconductor wafer over said electrical circuits;
- forming solderable contacts onto said semiconductor wafer;
- and
- thereafter, dicing said wafer into individual packaged dies.
Apparatus according to any of the preceding claims, substantially as shown and described hereinabove.
Apparatus according to any of the preceding claims, substantially as illustrated in any of the drawings.
A method, substantially as shown and described hereinabove.
A method, substantially as illustrated in any of the drawings.
Dependencies are inferred from the claim text.