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OwnerAndreas Huschka, Wolfram Kluge +1inventors
InventorsAndreas Huschka, Wolfram Kluge, Uwe Hahn
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A package for packaging a semiconductor die is provided that increases the reliability of packaged semiconductor circuits in particular in high frequency applications where both analog and digital signals are used. The package comprises a first die attach paddle which is connectable to a first part of a bottom surface of the semiconductor die, and a second die attach paddle which is connectable to a second part of the bottom surface of the semiconductor die. The first and second die attach paddles are each made of an electrically conductive material, and are electrically separated from each other. Further, a corresponding semiconductor device and a method of fabricating a package and packaging a semiconductor die are provided. When packaging dies having analog and digital circuits, separate grounds not only on the chip but also in the package can be achieved so that cross talking problems can be effectively reduced.
A package for packaging a semiconductor die and providing electrical contacts to said packaged semiconductor die, comprising:
A semiconductor device, comprising:
A method of fabricating a package for packaging a semiconductor die and providing electrical contacts to said packaged semiconductor die, the method comprising:
A method of packaging a semiconductor die, the method comprising:
Dependencies are inferred from the claim text.